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Al-Cu Symmetric/Asymmetric Tilt Grain Boundary Dataset
Symmetric and asymmetric tilt grain boundaries in Cu and Al were generated using molecular statics energy minimization in LAMMPS with in-plane grain boundary translations and an atom deletion criterion. The following ...
Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Workflow Protocols - Full report
(2016-06-07)
An adhesively bonded single lap joint was used to study the effects of coupon thickness, bondline thickness, surface preparation, presence of an overflow fillet, and adhesive type. Gains in the Education of Mathematics and ...