Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Work Flow Protocols - Failure surface images
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Date
2016-03-23Author
Jensen, Robert E.
DeSchepper, Daniel C.
Flanagan, David P.
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Mode-of-failure images and surveys, 300 dots per inch (dpi) resolution, Tagged Image File Format (TIFF)
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http://hdl.handle.net/11256/649Collections
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