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dc.contributorUS Army Research Laboratory, Weapons and Materials Research Directorate, Aberdeen Proving Ground, MD 21005, USAen_US
dc.contributor.authorJensen, Robert E.
dc.contributor.authorDeSchepper, Daniel C.
dc.contributor.authorFlanagan, David P.
dc.contributor.otherusarmy.APG.arl.mbx.adhesive-research@mail.milen_US
dc.date.accessioned2016-03-23T18:03:45Z
dc.date.available2016-03-23T18:03:45Z
dc.date.issued2016-03-23
dc.identifier.citationARL-TR-7696en_US
dc.identifier.urihttp://hdl.handle.net/11256/649
dc.description.abstractMode-of-failure images and surveys, 300 dots per inch (dpi) resolution, Tagged Image File Format (TIFF)en_US
dc.rightsCC0 1.0 Universal*
dc.rights.urihttp://creativecommons.org/publicdomain/zero/1.0/*
dc.subjectComputational File Repository Categories::PROPERTY CLASSES::Mechanicalen_US
dc.titleMultivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Work Flow Protocols - Failure surface imagesen_US
dc.typeImageen_US


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CC0 1.0 Universal
Except where otherwise noted, this item's license is described as CC0 1.0 Universal