dc.contributor | US Army Research Laboratory | en_US |
dc.contributor | College Qualified Leaders (CQL), Army Educational Outreach Program | en_US |
dc.contributor.author | Jensen, Robert E. | |
dc.contributor.author | Flanagan, David P. | |
dc.contributor.author | DeSchepper, Daniel C. | |
dc.contributor.author | Silton, Miriam S. | |
dc.contributor.other | usarmy.APG.arl.mbx.adhesive-research@mail.mil | en_US |
dc.date.accessioned | 2017-04-13T21:38:40Z | |
dc.date.available | 2017-04-13T21:38:40Z | |
dc.identifier.citation | ARL-TR-8011 | en_US |
dc.identifier.uri | http://hdl.handle.net/11256/939 | |
dc.description.abstract | A commercial 2-part epoxy was evaluated per ARL-ADHES-QA-001.00 rev 1.0, which consists of single-lap-joint testing at room temperature and subsequent hot/wet and elevated temperature conditioning. This testing protocol is intended to provide a minimal recommendation for adhesive selection for Army ground vehicle applications. The epoxy adhesive used for this research is a known aerospace benchmark and was selected to judge the stringency of ARL-ADHES-QA-001.00 rev 1.0, which suggests that the elevated temperature strength retention requirements should be relaxed. | en_US |
dc.description.sponsorship | This research was supported in part by the US Army Education Outreach – Science and Engineering Apprentice Program - College Qualified Leaders Program at the US Army Research Laboratory and was administered by Academy of Applied Science (under contract number W911SR-15-2-0001). | en_US |
dc.rights | CC0 1.0 Universal | * |
dc.rights.uri | http://creativecommons.org/publicdomain/zero/1.0/ | * |
dc.subject | adhesive, single lap joint, epoxy, pretreatment, hot/wet, elevated temperature | en_US |
dc.title | Single-Lap-Joint Screening of Hysol EA 9309NA Epoxy Adhesive | en_US |
dc.type | Dataset | en_US |
dc.type | Image | en_US |
dc.type | Other | en_US |
cc.keywords | adhesive, single -lap -joint, epoxy, pretreatment, hot/wet, elevated temperature, Hysol EA9309NA, 3-aminopropyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane | |