Browsing Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Work Flow Protocols by Author "usarmy.APG.arl.mbx.adhesive-research@mail.mil"
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Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Work Flow Protocols - Analysis results
Jensen, Robert E.; DeSchepper, Daniel C.; Flanagan, David P. (2016-03-24)Formatted categorical and numerical variables for multivariate analysis -
Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Work Flow Protocols - Failure surface images
Jensen, Robert E.; DeSchepper, Daniel C.; Flanagan, David P. (2016-03-23)Mode-of-failure images and surveys, 300 dots per inch (dpi) resolution, Tagged Image File Format (TIFF) -
Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Work Flow Protocols - Load vs. displacement data
Jensen, Robert E.; DeSchepper, Daniel C.; Flanagan, David P. (2016-03-24)Raw and analyzed load versus displacement data, including semi-automated routines for maximum strength, displacement, and area under the curve -
Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Work Flow Protocols - Supplementary data
Jensen, Robert E.; DeSchepper, Daniel C.; Flanagan, David P. (2016-03-24)Supporting technical data sheets, MSDS, surface pretreatment and bonding processes, travel sheets, and mode-of-failure surveys -
Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Work Flow Protocols – Constitutive mechanical properties
Jensen, Robert; DeSchepper, Daniel; Flanagan, David (2018-05-31)Tensile stress-strain mechanical test results and analysis for the adhesives and aluminum adherend. -
Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Workflow Protocols - Full report
Jensen, Robert E.; DeSchepper, Daniel C.; Flanagan, David P. (2016-06-07)An adhesively bonded single lap joint was used to study the effects of coupon thickness, bondline thickness, surface preparation, presence of an overflow fillet, and adhesive type. Gains in the Education of Mathematics and ...