Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Workflow Protocols - Full report
Jensen, Robert E.
DeSchepper, Daniel C.
Flanagan, David P.
MetadataShow full item record
An adhesively bonded single lap joint was used to study the effects of coupon thickness, bondline thickness, surface preparation, presence of an overflow fillet, and adhesive type. Gains in the Education of Mathematics and Science high school and middle school students prepared 960 single-lap-joint samples with US Army Research Laboratory (ARL) technicians fabricating an additional 245 controls. Workflow protocol was orchestrated using ARL’s Materials Selection and Analysis Tool relational database. Moreover, the enhanced pedigree and integrity enabled by centering workflow on a robust relational database allow for supplemental release of all raw and analyzed experimental data, along with associated metadata, in downloadable format that is included with this report.
This item URIhttp://hdl.handle.net/11256/699
The following license files are associated with this item:
Showing items related by title, author, creator and subject.
Tschopp, Mark A.; Coleman, Shawn P.; McDowell, David L.Symmetric and asymmetric tilt grain boundaries in Cu and Al were generated using molecular statics energy minimization in LAMMPS with in-plane grain boundary translations and an atom deletion criterion. The following ...
Taylor, A; Doyle, N.J. (1972-01-31)New lattice parameter and density results have been obtained for alloys in the fl-NiA1 and 6-Ni2A13 phase fields of the nickel-aluminum system. The lattice parameter of the fl-NiAl phase (CsCl-type) falls linearly from ...
Angsten, Thomas; Mayeshiba, Tam; Wu, Henry; Morgan, Dane (2014-08-08)This work demonstrates how databases of diffusion-related properties can be developed from high-throughput ab initio calculations. The formation and migration energies for vacancies of all adequately stable pure elements ...