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dc.contributorUS Army Research Laboratory, Weapons and Materials Research Directorate, Aberdeen Proving Ground, MD 21005, USAen_US
dc.contributor.authorJensen, Robert E.
dc.contributor.authorDeSchepper, Daniel C.
dc.contributor.authorFlanagan, David P.
dc.identifier.citationARL-TR-7696, June 2016en_US
dc.description.abstractAn adhesively bonded single lap joint was used to study the effects of coupon thickness, bondline thickness, surface preparation, presence of an overflow fillet, and adhesive type. Gains in the Education of Mathematics and Science high school and middle school students prepared 960 single-lap-joint samples with US Army Research Laboratory (ARL) technicians fabricating an additional 245 controls. Workflow protocol was orchestrated using ARL’s Materials Selection and Analysis Tool relational database. Moreover, the enhanced pedigree and integrity enabled by centering workflow on a robust relational database allow for supplemental release of all raw and analyzed experimental data, along with associated metadata, in downloadable format that is included with this report.en_US
dc.rightsCC0 1.0 Universal*
dc.subjectComputational File Repository Categories::ALL CHEMICAL SYSTEMSen_US
dc.subjectComputational File Repository Categories::EXPERIMENTAL TECHNIQUESen_US
dc.subjectComputational File Repository Categories::METHODSen_US
dc.subjectComputational File Repository Categories::PROCESSINGen_US
dc.subjectComputational File Repository Categories::PROPERTY CLASSESen_US
dc.titleMultivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Workflow Protocols - Full reporten_US

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CC0 1.0 Universal
Except where otherwise noted, this item's license is described as CC0 1.0 Universal